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Catch up on the latest news from ��Ƶ and our industry partners

Jul 29, 2026

��Ƶ signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership

Learn more: ��Ƶ signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership
Jun 23, 2026

��Ƶ qualifies SLATE^? advanced packaging technology on 9SW platform for next-generation radio frequency applications

Learn more: ��Ƶ qualifies SLATE? advanced packaging technology on 9SW platform for next-generation radio frequency applications
May 20, 2025

��Ƶ partners with A*STAR to accelerate advanced packaging innovation

Learn more: ��Ƶ partners with A*STAR to accelerate advanced packaging innovation
Jan 17, 2025

��Ƶ Announces New York Advanced Packaging and Photonics Center

Learn more: ��Ƶ Announces New York Advanced Packaging and Photonics Center

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